Question

Arrange the following thin film deposition techniques in increasing order of their deposition rate:
A. Pulse laser deposition,
B. rf Sputtering,
C. Thin film deposition by thermal evaporation,
D. Spin coating.

• A. A, B, C, D
• B. B, C, A, D
• C. A, C, D, B
• D. B, A, C, D

Hint:

Among common thin film methods, sputtering is usually slower, while spin coating is comparatively fast.

Answer 1

The Correct Option is D

Concept:
Different thin film deposition methods have different deposition rates depending on the mechanism of material transfer.

Step 1: rf Sputtering.
rf sputtering generally has a comparatively slow deposition rate. \[ \text{First}=B \]

Step 2: Pulsed laser deposition.
Pulsed laser deposition has a higher deposition rate than sputtering in this order. \[ \text{Second}=A \]

Step 3: Thermal evaporation.
Thermal evaporation can deposit films faster than sputtering and PLD. \[ \text{Third}=C \]

Step 4: Spin coating.
Spin coating is a solution-based method and can produce a film quickly over a substrate. \[ \text{Fourth}=D \] Thus, increasing order is: \[ B,A,C,D \] \[ \therefore \text{Correct Answer is (D)} \]