Question:

The mechanism of thermal resistance of bacterial spore is due to the presence of:

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Ca-DPA: key to spore heat resistance.
Present in spore core.
Stabilizes spore proteins.
  • Calcium dipicolinic acid
  • Orthophosphoric acid
  • Teichoic acid
  • Lipopolysaccharide
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The Correct Option is A

Solution and Explanation


Step 1: Understanding the Concept:
Bacterial spores are highly resistant to heat.
Certain compounds contribute to this resistance.
Step 2: Key Formula or Approach:
No specific formula.
Need to know the components of bacterial spores.
Step 3: Detailed Explanation:
Calcium dipicolinic acid (Ca-DPA) is responsible for thermal resistance.
It is present in the spore core.
It stabilizes the spore proteins.
Orthophosphoric acid is not a spore component.
Teichoic acid is found in cell walls.
Lipopolysaccharide is found in Gram-negative cell walls.
Thus, calcium dipicolinic acid is responsible.
Step 4: Final Answer:
Calcium dipicolinic acid is responsible for thermal resistance.
Hence, the correct option is (A). \bigskip
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